1. 2. 3. material content data sheet sales product name tle4271-2g issued 29. august 2013 ma# MA000723252 package pg-to263-7-1 weight* 1566.90 mg construction element material group substances cas# if applicable weight [mg] average mass [%] sum [%] average mass [ppm] sum [ppm] chip inorganic material silicon 7440-21-3 4.930 0.31 0.31 3146 3146 leadframe non noble metal iron 7439-89-6 0.916 0.06 585 inorganic material phosphorus 7723-14-0 0.275 0.02 175 non noble metal copper 7440-50-8 914.823 58.38 58.46 583843 584603 wire non noble metal aluminium 7429-90-5 0.397 0.03 0.03 253 253 encapsulation organic material carbon black 1333-86-4 1.254 0.08 801 plastics epoxy resin - 57.707 3.68 36829 inorganic material silicondioxide 60676-86-0 568.286 36.27 40.03 362683 400313 leadfinish non noble metal tin 7440-31-5 13.037 0.83 0.83 8320 8320 plating non noble metal nickel 7440-02-0 0.212 0.01 136 inorganic material phosphorus 7723-14-0 0.001 0.00 0.01 0 136 solder noble metal silver 7440-22-4 0.126 0.01 81 non noble metal tin 7440-31-5 0.101 0.01 65 non noble metal lead 7439-92-1 4.830 0.31 0.33 3083 3229 *deviation < 10% sum in total: 100,00 1000000 important remarks: infineon technologies ag provides full material declaration based on information provided by third parties and has taken and continues to take reasonable steps to provide representative and accurate information. infineon technologies ag and infineon technologies ag suppliers consider certain information to be proprietary, and thus cas numbers and other limited information may not be available for release. all statements are based on our present knowledge, are provided 'as is' and may be subject to change at any time due to technical requirements and development without notification. company infineon technologies ag address 81726 mnchen internet www.infineon.com
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